diff --git a/eda/hvsp.kicad_pcb b/eda/hvsp.kicad_pcb new file mode 100644 index 0000000..24b08dc --- /dev/null +++ b/eda/hvsp.kicad_pcb @@ -0,0 +1,9334 @@ +(kicad_pcb + (version 20241229) + (generator "pcbnew") + (generator_version "9.0") + (general + (thickness 1.6) + (legacy_teardrops no) + ) + (paper "A5") + (title_block + (title "AtTiny85 HVSP PCB") + (company "Behold!") + ) + (layers + (0 "F.Cu" signal) + (2 "B.Cu" signal) + (9 "F.Adhes" user "F.Adhesive") + (11 "B.Adhes" user "B.Adhesive") + (13 "F.Paste" user) + (15 "B.Paste" user) + (5 "F.SilkS" user "F.Silkscreen") + (7 "B.SilkS" user "B.Silkscreen") + (1 "F.Mask" user) + (3 "B.Mask" user) + (17 "Dwgs.User" user "User.Drawings") + (19 "Cmts.User" user "User.Comments") + (21 "Eco1.User" user "User.Eco1") + (23 "Eco2.User" user "User.Eco2") + (25 "Edge.Cuts" user) + (27 "Margin" user) + (31 "F.CrtYd" user "F.Courtyard") + (29 "B.CrtYd" user "B.Courtyard") + (35 "F.Fab" user) + (33 "B.Fab" user) + (39 "User.1" user) + (41 "User.2" user) + (43 "User.3" user) + (45 "User.4" user) + ) + (setup + (stackup + (layer "F.SilkS" + (type "Top Silk Screen") + ) + (layer "F.Paste" + (type "Top Solder Paste") + ) + (layer "F.Mask" + (type "Top Solder Mask") + (thickness 0.01) + ) + (layer "F.Cu" + (type "copper") + (thickness 0.035) + ) + (layer "dielectric 1" + (type "core") + (thickness 1.51) + (material "FR4") + (epsilon_r 4.5) + (loss_tangent 0.02) + ) + (layer "B.Cu" + (type "copper") + (thickness 0.035) + ) + (layer "B.Mask" + (type "Bottom Solder Mask") + (thickness 0.01) + ) + (layer "B.Paste" + (type "Bottom Solder Paste") + ) + (layer "B.SilkS" + (type "Bottom Silk Screen") + ) + (copper_finish "None") + (dielectric_constraints no) + ) + (pad_to_mask_clearance 0) + (allow_soldermask_bridges_in_footprints no) + (tenting front back) + (pcbplotparams + (layerselection 0x00000000_00000000_55555555_5755f5ff) + (plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000) + (disableapertmacros no) + 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